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| FUJITSU SEMICONDUCTOR DATA SHEET DS07-20101-7E Resonator Piezoelectric Resonator FAR Family (C1, C3, C4 series) s DESCRIPTION Fujitsu resonators (C1, C3, C4 series) feature originally developed single crystals with a high electromechanical coupling coefficient (LiTaO3: lithium tantalate, LiNbO3: lithium niobate), the result is compact packaging. Three series are available: the C3 and C4 series with built-in capacitors for high integration, for exclusive use in microcomputer clocks; and the C1 series for high precision. All series include the CHIP type device for surfacemount and the SIP type device for general PC boards. s FEATURES * * * * Surface-mount technology can be applied to the CHIP type to increase packaging density. The SIP type is only half the height of conventional quartz crystal resonators, and can be easily mounted on general PC boards. The C3 and C4 series have been developed for exclusive use in microcomputer clocks. They have built-in capacitors, and the number of components has been reduced to one-third of that of conventional circuits. Both the SIP and CHIP types can be shipped in taped packages for automatic mounting. The resonators have superior shock and vibration resistance, preventing damage during automatic insertion process. s PACKAGE FAR Family (C1, C3, C4 series) s STANDARD CHARACTERISTICS Series Parameter Material Frequency Standard frequency Initial frequency tolerance Temperature characteristics (-20 to 60C) Capacity of built-in capacitor Aging stability Operating temperature Storage temperature (Resonant frequency and serial resonant resistance) R: Resonator C1 series C3 series C4 series Lithium Niobate (LiNbO3) 3 to 16 MHz Lithium Tantalate (LiTaO3) 3.58 to 16 MHz See "s Standard frequency." 0.05% (G) 0.1% (J) 0.3% (K) 0.5% (M) 0.02% -- 0.1% (J) 0.3% (K) 0.5% (M) 0.05% 0.5% (M) 0.3% (K) 1% (L) 0.5% 208 pF (standard)* Within 0.1% -30 to 85C -40 to 100C (Oscillation frequency) 3 MHz to 10 MHz max. IC; 1/6MB84069B x 2 10 MHz to 16 MHz IC; MC74HC04 VCC; 5 VDC R; Resonator C1, C2: Loading capacitors (built-in) FAR (Serial resonant resistance) R 75 OSC C1 C2 R: Resonator 1 M R 30 pF R 75 OSC 75 C1 C2 LM Standard measuring circuit 75 LM *: The capacity of the built-in capacitor is 208 pF by standard. 104 pF and 308 pF types are also available. However, the characteristics of 104 pF and 308 pF types are specified by Fujitsu, considering matching data with applied IC (mainly microcomputer). 2 FAR Family (C1, C3, C4 series) s STANDARD FREQUENCY Standard frequency (kHz) 3,580 4,000 4,194 4,915 6,000 6,144 7,373 8,000 10,000 11,000 11,059 12,000 14,746 16.000 * C1/C3 series Package size A A A A B B B B B B B B B B Resonant resistance 300 max. (00) Package size A A A A B B B B B B B B B B C4 series Resonant resistance 150 max. (01) 150 max. (01) 75 max. (02) Package sizes and resonant resistance There are two package sizes according to frequency: Frequency 3 to 5.99 MHz 6 to 16 MHz Package size A B For resonant resistance, standard values are specified according to frequency: Frequency 3 to 3.57 MHz 3.58 to 5.99 MHz 6 to 16 MHz Standard resonant resistance C1/C3 series -- 300 max. (00) 150 max. (01) C4 series 300 max. (00) 150 max. (01) 75 max. (02) Note: For resonant resistance other than the standard values, they are specified by Fujitsu considering matching data with applied IC (mainly micro computer). s NOTES ON USE * * Handle carefully. Solder under the following conditions. CHIP type: 5 seconds max. at 230C (PCB) SIP type: 10 seconds max. at 260C Do not apply extreme heat to the resonator. Recommended preheating for the CHIP type is 150C for one minute. Avoid extreme fluctuations in temperature during use. There is no specific direction in resonator mounting. Additional information is available separately, if required, for designing microcomputer oscillation circuits. CHIP type is for reflow solder, not for flow solder. 3 * * * * FAR Family (C1, C3, C4 series) s PART NUMBERING SYSTEM FAR (1) (2) (3) (4) (5) (6) (7) (8) (1) Series Series C1 C3 C4 Single crystal LiTaO3 LiTaO3 LiNbO3 Capacitor -- With built-in capacitors With built-in capacitors (2) Package type Specification C S Type CHIP SIP (3) Package size See Table 1 in "s Dimensions." Specification A B Size Large Small (4) Frequency (kHz) Frequency Designation Frequency Designation Frequency Designation Frequency Designation 3,580 kHz 4,000 kHz 4,194 kHz 4,195 kHz 03580 04000 04194 04915 6,000 kHz 6,144 kHz 7,373 kHz 8,000 kHz 06000 06144 07373 08000 10,000 kHz 11,000 kHz 11,059 kHz 12,000 kHz 10000 11000 11059 12000 14,746 kHz 16,000 kHz 14746 16000 (5) Initial tolerance of frequency See "s Standard Frequency." Specification G J K M L 4 Tolerance 0.05% 0.1% 0.3% 0.5% 1% C1 series available available available avaialble -- C3 series -- available available available -- C4 series -- -- available available available FAR Family (C1, C3, C4 series) (6) Capacity of built-in capacitor Specification 0 1 2 Note: For C1 series, only "0" is available. Capacitance 208 pF 104 pF 308 pF (7) Resonant resistance Specification 0 1 2 Resonant resistance 300 max. 150 max. 75 max. (8) User-specific Special Symbols Specification Name -- A to Z Description No specification, no taping specification No specification, with taping specification Serial number for custom design (9)Taping specification * SIP type Specification -T -U Description Reel pack Ammo pack * CHIP type Specification -R Description 16 mm carrier pack 5 FAR Family (C1, C3, C4 series) s MARKING (SIP type) Fujitsu's parts abbreviation Frequency (kHz) (CHIP type) Fujitsu's parts abbreviation Frequency (kHz) F 4000 T k m Lot No. (Date of manufacture, conforms to EIAJ) Initial frequency tolerance Characteristics: T: LiTaO3 N: LiNbO3 F 1200 T k m Lot No. (Date of manufacture, conforms to EIAJ) Initial frequency tolerance Characteristics: T: LiTaO3 N: LiNbO3 The stamp color varies with the capacity of the capacitor. Capacitance Marking clolr 10 pF 20 pF 30 pF Yellow White Gray Data code (EIAJ standard) is specified as follows in a four-year cycle. Year Month Symbol 1 2 3 1977 1981 1985 1989 1993 4 5 6 7 8 9 10 11 12 A B C D E F G H J K L M 1978 1982 1986 1990 1994 Year Month Symbol 1 2 3 4 5 6 7 8 9 10 11 12 N P Q R E T U V W X Y Z 1979 1983 1987 1991 1995 Year Month Symbol 1 2 3 4 5 6 7 8 9 10 11 12 j d e f 1980 1984 1988 1992 1996 a b Year Month Symbol 1 2 3 4 5 6 7 8 9 10 11 12 t u r n 6 FAR Family (C1, C3, C4 series) s PIN ASSIGNMENT * C1 series SIP type CHIP type 1 1 2 (Equivalent circuit) 1 * C3 and C4 series SIP type 2 2 CHIP type 1 1 2 3 (Equivalent circuit) 1 3 2 3 2 7 FAR Family (C1, C3, C4 series) s DIMENSIONS Table 1 Package size a Type A SIP type B A CHIP type B 8.0 0.5 (0.315 0.020) 7.4 0.2 (0.291 0.008) 3.2 0.5 (0.126 0.020) 2.5 0.3 (0.098 0.012) 9.0 0.2 (0.354 0.008) 10.0 0.5 (0.394 0.020) -- 9.4 0.2 (0.370 0.008) 4.3 0.2 (0.169 0.008) 4.5 0.5 (0.177 0.020) 5.3 0.2 (0.209 0.008) 2.5 0.3 (0.098 0.012) 5.08 0.2 (0.200 0.008) L 11.0 0.2 (0.433 0.008) L1 -- W 4.3 0.2 (0.169 0.008) H Two terminal 6.3 0.2 (0.248 0.008) Unit: mm (in.) Three terminal 2.54 0.2 (0.100 0.008) SIP type L W L W H 0.35 0.1 (0.014 0.004) 0.5 0.2 (0.020 0.008) a 3.4 0.2 (0.134 0.008) C1 series 0.5 0.2 (0.020 0.008) a a H 0.35 0.1 (0.014 0.004) 3.4 0.2 (0.134 0.008) C3 and C4 series CHIP type L1 H L1 H L1 H L 1.5 (0.059) 1.5 (0.059) L 1.5 (0.059) L W W W a 0.45 (0.018) 0.95 (0.037) a a 0.45 (0.018) 0.95 (0.037) a a C1 series C3 series C4 series 8 FAR Family (C1, C3, C4 series) s TAPING FORM AND DIMENSIONS * SIP type 3.81 0.7 (0.150 0.028) 6.35 1.3 (0.250 0.051) 12.7 1.0 (0.500 0.394) Unit: mm (in.) 3.0 max. (0.118) 18.0 0.5 (0.709 0.020) 9.0 2 (0.354 0.079) 12.5 min. (0.492) +1.0 18.0 -0.5 +0.040 (0.709 -0.020 ) 12.7 0.3 (0.500 0.012) Designation T U Note: Pack form Reel pack Ammo pack Pack quantity (pcs) 4.0 0.3 (0.157 0.012) Package size A Package size B 1000 1500 1000 1500 1. In reel packs, the tolerance of the cumulative feed hole pitch (20 pitches) is 1.3 (0.051) or less. 2. In ammo packs, there must be perforations every 25 pitches. * CHIP type 4 0.1 (0.157 0.004) 2 0.1 (0.079 0.004) Unit: mm (in.) 1.5 0.1 (0.059 0.004) 7.65 0.1 (0.301 0.004) 16 0.2 (0.630 0.008) 6.85 (0.270) W 0.1 (0.004) Package size A B 4.9 (0.193) 3.6 (0.142) W 10.4 (0.409) 8.4 (0.331) 8 0.15 (0.315 0.006) Reel form 0.1 (0.004) 3.0 0.1 (0.118 0.004) 2.0 (0.080) 13.0 (0.512) 75 (2.953) 1.0 (0.039) 21.0 (0.827) * Pack quantity Package size A B Pack quantity 3,000 pcs 3,400 pcs 330 2.0 (12.992 0.079) 2.0 (0.079) 18.0 (0.709) 9 FAR Family (C1, C3, C4 series) s APPLICATION EXAMPLES * C1 series 22 pF to 47 pF R 680 TTL oscillation circuit (serial resonation circuit) 220 IC R: Resonator IC: MB74LS04 1.8 k Output IC * C3, C4 series 1 MB8850 MB8850H series 2 1 3 R R: Resonator 2 s RELIABILITY Parameter Shock Vibration Drop Sealing Heat resistance Temperature cycling High-temperature loading test High-temperature humidity test Test conditions MIL-STD-883B, 2002, condtion C (3000G) MIL-STD-202E, 201A (1.5 mm <0.059> at 10 Hz to 55 Hz for 2 hours) 5 times drop from 1 m (39.370 in.) height to wooden board. Immersion in water at 85C Requirements Frequency fluctuation: within 0.1% Frequency fluctuation: within 0.1% Frequency fluctuation: within 0.1% No bubbles observed MIL-STD-202E, 210A condition B (260C * 5 sec.) Frequency fluctuation: within 0.1% MIL-STD-883B, 1010, condition A (-35 to 85C, 10 cycle) MIL-STD-883B, 1008, condition B 1000 h (100C * 1000 hours) MIL-STD-202E, 103A, condition B (96 hours at 60C, 90% to 95% RH, 12 VDC) Frequency fluctuation: within 0.1% Frequency fluctuation: within 0.1% Frequency fluctuation: within 0.1% 10 FAR Family (C1, C3, C4 series) FUJITSU LIMITED For further information please contact: Japan FUJITSU MEDIA DEVICES LIMITED Marketing and Technical Support Dept. SHINYOKOHAMA SQUARE BLDG 2-3-12,Shin-yokohama, Kouhoku-ku, Yokohama-shi, Kanagawa 222-0033, Japan Tel: +81-45-471-0067 Fax: +81-45-471-0069 http://www.fujitsu.co.jp/hypertext/fmd/English/index.html All Rights Reserved. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. The information and circuit diagrams in this document are presented as examples of semiconductor device applications, and are not intended to be incorporated in devices for actual use. Also, FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of this information or circuit diagrams. The contents of this document may not be reproduced or copied without the permission of FUJITSU LIMITED. FUJITSU semiconductor devices are intended for use in standard applications (computers, office automation and other office equipments, industrial, communications, and measurement equipments, personal or household devices, etc.). CAUTION: Customers considering the use of our products in special applications where failure or abnormal operation may directly affect human lives or cause physical injury or property damage, or where extremely high levels of reliability are demanded (such as aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to consult with FUJITSU sales representatives before such use. The company will not be responsible for damages arising from such use without prior approval. Any semiconductor devices have inherently a certain rate of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Control Law of Japan, the prior authorization by Japanese government should be required for export of those products from Japan. North and South America FUJITSU MICROELECTRONICS, INC. 3545 North First Street, San Jose, CA 95134-1804, U.S.A. Tel: +1-408-922-9000 Fax: +1-408-922-9179 Customer Response Center Mon. - Fri.: 7 am - 5 pm (PST) Tel: +1-800-866-8608 Fax: +1-408-922-9179 http://www.fujitsumicro.com/ Europe FUJITSU MICROELECTRONICS EUROPE GmbH Am Siebenstein 6-10, D-63303 Dreieich-Buchschlag, Germany Tel: +49-6103-690-0 Fax: +49-6103-690-122 http://www.fujitsu-fme.com/ Asia Pacific FUJITSU MICROELECTRONICS ASIA PTE. LTD. #05-08, 151 Lorong Chuan, New Tech Park, Singapore 556741 Tel: +65-281-0770 Fax: +65-281-0220 http://www.fmap.com.sg/ F9703 (c) FUJITSU LIMITED Printed in Japan |
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